1. 特 点:
l 贴片式,Ag(Cu)-Ni-Sn三层端电极,良好的可焊性和耐焊接热性能,适用于混合集成电路或印刷电路的表面贴装;
l 介电常数高,电容器容量体积比大;
l 适用于电子设备中的旁路、滤波、低频耦合电路或对损耗和电容量稳定性要求不高的电路中;
l 执行标准:GB/T 21042-2007《电子设备用固定电容器 第22部分 表面安装用2类多层瓷介固定电容器》。
2. 主要性能指标:
l 容量温度特性:-55℃~125℃,容量变化率不超过±15%;
l 偏压特性:施加额定电压,容量变化率:+15-25%,-55℃~125℃(-55℃~85℃);
l 介质损耗:
Ⅱ类 (X7R,X5R) | Ur | ≥100V | 50V | 25V | 16V | 10V | 6.3V |
DF | ≤2.5% | ≤3.5% | ≤3.5% | ≤5.0% | ≤5.0% | ≤7.5%(CR<3.3μF) ≤10.0%(CR≥3.3μF) |
l 老化特性:每十进制小时不超过3%;
l 绝缘电阻:(在20℃下)
静电容量 | Cr ≤25nF | Cr >25nF |
绝缘电阻 | Ri≥4000MΩ | Ri* Cr ≥100S |
l 介质耐电压:
标称额定电压 | Ur<200V | 200V≤Ur≤1000V | Ur>1000V |
介质耐电压(V) | ≥2.5 Ur | ≥1.5 Ur | ≥1.2 Ur |
3. 特性曲线:
4.产品容量范围
尺寸规格 | 额定电压 | 容量范围(单位:pF) |
0603 | 100V | 100~10,000 |
200V | 100~6,800 | |
0805 | 100V | 100~33,000 |
200V | 100~22,000 | |
500V | 100~10,000 | |
1206 | 100V | 100~100,000 |
200V | 100~47,000 | |
500V | 100~22,000 | |
1000V | 100~5,600 | |
2000V | 100~1,500 | |
1210 | 100V | 150~220,000 |
200V | 150~100,000 | |
500V | 150~33,000 | |
1000V | 150~10,000 | |
2000V | 150~6,800 | |
1808 | 100V | 150~220,000 |
200V | 150~100,000 | |
500V | 150~39,000 | |
1000V | 150~10,000 | |
2000V | 150~6,800 | |
3000V | 150~2,200 | |
4000V | 150~1,000 | |
1812 | 100V | 220~330,000 |
200V | 220~150,000 | |
500V | 220~100,000 | |
1000V | 220~27,000 | |
2000V | 220~10,000 | |
3000V | 220~2,200 | |
4000V | 220~1,500 | |
2225 | 100V | 220~1,000,000 |
200V | 220~1,000,000 | |
500V | 220~470,000 | |
1000V | 220~56,000 | |
2000V | 220~27,000 | |
3000V | 220~3,900 | |
4000V | 220~3,300 |
注:可根据客户特殊要求时,设计客户的需要的电压及容量。
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